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filingDate 1960-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1962-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-903977-A
titleOfInvention Improvements in or relating to adhesives
abstract A composition suitable for use as an adhesive comprises a bodied polyamide resin and less than 0,5% by weight of the polyamide resin of an epoxy resin having an epoxy equivalent weight of from 170 to 1,000, said polyamide resin being a homogenous blend of from 60 to 75% by weight of polyamide resin A and 25 to 40% by weight of polyamide resin B, said resin A being the bodied reaction product of a polymeric fatty acid and a polyalkylene polyamine containing two primary amino groups and from one to three secondary amino groups, all separated by alkylene groups having 2 to 4 carbon atoms, said resin B being the reaction product of an alkylene polyamine and a mixture of a polymeric fatty acid and another polymeric acid, the blend of A and B having been heated at a temperature within the approximate range of 200 DEG to 300 DEG C. for a time sufficient to effect an amide interchange between the polyamide resins. Specified epoxy resins are the reaction products of polyhydric phenols with polyfunctional halohydrins and/or glycerol dichlorohydrate. The polymeric fatty acids employed are those resulting from the polymerization of drying or semidrying oils or their free acids or the simple aliphatic alcohol esters thereof. Resin A is bodied by heating at 200 DEG to 300 DEG C. Specified polycarboxylic acids are glutaric, adipic, pimelic, sebacic, suberic, azelaic, terephthalic and isophthalic acid. In the example, resin A is made from polymerized linoleic acid and diethylene triamine and resin B is made from polymerized linoleic acid, sebacic acid and ethylene diamine. The compositions are used for bonding the seams of metal containers.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2175305-A
priorityDate 1959-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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