http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-841087-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fbd3cefb4f504c554f2859b7eee1ff4e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate | 1957-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb7b4fbf99e2dfe6b6ceb2fb2acea5b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a8a73dcf14d86e9bcc18e0efcf50d59 |
| publicationDate | 1960-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-841087-A |
| titleOfInvention | Improvements in or relating to the hermetic sealing of containers for electrical devices |
| abstract | 841,087. Soldering. GENERAL ELECTRIC CO. Ltd. Nov. 24, 1958 [Nov. 22, 1957], No. 36496/57. Class 83 (4). [Also in Group XXXVI]. In sealing an aperture 3 in a substantially flat metal part of a container 1 for an electrical device, the space within the container other than that occupied by the operative part of the device being substantially filled with an electrically insulating material which is either liquid at normal temperatures or is readily liquefied by the application of heat, a thin layer of metal of relatively low melting-point is formed on the outer surface of the metal part surrounding the aperture, and is then cleaned, a plate 19 of metal of relatively high melting- point is placed on the clean surface to cover the aperture, the thin layer is melted by passing an electric current momentarily between the plate and the metal part while at the same time holding the plate in position over the aperture and rotating the container and plate together so as to cause the molten metal to flow towards the periphery of the plate and while still rotating the container and plate together the molten metal is allowed to resolidify to bond the plate to the container over the aperture. A circular well 2, with a hole 3 at the bottom, provided at one end of a cylindrical copper cap 1, is filled with solder 4 without closing the hole and then a cylindrical recess 5 is cut therein by a cutting-tool with a pilot pin in the hole. The cap is chemically cleaned and the electrode system of a germanium transistor mounted on a copper skirt is placed in the cap and flanges 10, 11 on the skirt and cap are cold-welded. The assembly is vacuum baked and filled with wax 12 and a clean surface is produced at the bottom of the recess by a cutting-tool 13. The assembly is held in a chuck 17 rotatable by a motor 18 on one electrode 15, a thin dished tinned copper disc 19 is placed in the recess and the other electrode 16 is pressed against it. The motor rotates the chuck and current is passed between the electrodes for <SP>1</SP>/ 10 second to melt the solder which flows to the periphery of the disc. The current is switched off and when the solder has solidified the motor is stopped. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1976361-A3 |
| priorityDate | 1957-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.