http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-831929-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-40 |
| filingDate | 1958-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1960-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-831929-A |
| titleOfInvention | Improvements in or relating to copper plating |
| abstract | 831,929. Copper-plating baths. DU PONT DE NEMOURS & CO., F. I. May 30, 1958 [June 20, 1957], No. 17404/58. Class 41. A copper-plating bath contains free alkali cyanide together with small amounts of a water-soluble selenate or selenite, a selenide, and also the alkali metal salt of methylene-bis-α- naphthalene sulphonic acid. In an example, to a solution containing copper cyanide, free sodium or potassium cyanide, sodium or potassium hydroxide or carbonate and a little of the naphthalene sulphonic acid compound, there is added (a) 10 to 250 parts by weight per 10<SP>6</SP> of sodium selenate and (b) 0.01 to 0.1 part of a solution of copper selenoide in KCN. Parts are calculated as by weight of selenium metal contained. Plating preferably proceeds with periodic current reversal, and using a moving cathode. Specification 630,165 and U.S.A. Specifications 2,701,234 and 2,770,587 are referred to. |
| priorityDate | 1957-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.