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filingDate 1946-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1948-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-607913-A
titleOfInvention Improvements in or relating to resinous bonding or adhesive compositions
abstract An adhesive comprises a soluble condensate obtained by reacting 100 parts of phenol or a homologue thereof, 10 to 110 parts (by weight of phenol) or a primary or secondary mono or diamines of benzene, naphthalene, or their homologue and from 1 to 1.2 mols. (per mol. of phenol and amine together) of formaldehyde, acid 0.3 to 10 times the weight of condensate of a thermoplastic polyvinyl compound. There are specified: phenols-phenol, cresols, cresylic acid; arylamines-aniline, diphenylamine, o-, m-, and p-toluidines, m-phenylenediamine, naphthylamine, and mixtures thereof; vinyl compounds-polyvinyl acetate, acetate-chloride, alcohol, formal, and acetal, polystyrene, polymethylacrylate, polymethyl and polypropyl methacrylate. Formaldehyde may be used as aqueous solution, paraformaldehyde, trioxymethylene, hexamethylenetetramine or other substance yielding formaldehyde. Preparation of the phenol-arylamine-formaldehyde condensate is carried out in the presence of a basic catalyst, e.g. lime, ammonia, ethylene diamine, or ethanolamine, preferably at low temperature in a closed vessel, e.g. by refluxing for about 1 hour at 100 DEG C. and then dehydrating under vacuum. In examples: (1) aniline and phenol; (2) aniline, diphenylamine, and cresylic acid; (3) diphenylamine and phenol are condensed with paraformaldehyde and 40 per cent aqueous formaldehyde in the presence of ethylene diamine in the manner described above, and the products were dissolved in benzene In preparing the adhesive, the phenol arylamine-formaldehyde condensate solution is combined with a solution of the thermoplastic polyvinyl compound. In examples, compositions comprise the aniline-phenol-formaldehyde condensate of example 1, together with polyvinyl acetate in benzene, acetone and ethyl acetate or with polypropyl methacrylate in methyl ethyl ketone and ethyl acetate. The adhesives may be used for bonding articles, e.g. sheets, plates, blocks, or rods, of wood, metal, ceramines, or natural or synthetic resins. In particular, they may be used to bond cotton, asbestos, or glass tape to copper conductors, in the production of pressboard spacers, electrical coils, and magnetic cores (see Group XXXV).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2701776-A
priorityDate 1945-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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