http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2591470-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3ee8df6e3f0205aac3bb6c143983740f
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3605
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3754
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375
filingDate 2020-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d25b57ed11c7f5e454c57b2bf871d3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e33aae80e1e1881a0e18ef83995ec27
publicationDate 2021-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-2591470-A
titleOfInvention Feedthrough comprising interconnect pads
abstract A feedthrough 1 that may be for an implantable medical device, comprising a ceramic body 2 having first 3 and second 4 sides, a conductor 5 extending between said sides, a conductive pad 6a connected to the conductive element and bonded to the ceramic body through a bonding layer 7 comprising an active braze alloy. The conductor may be in brazed or braze-less contact with the ceramic between the first and second sides. The feedthrough may comprise a plurality of conductors at a density exceeding 1 per 100,000 µm2. The active braze may comprise alloys including Au, Cu, Ag, Ni, Ti, Zr, Nb, Ta, V, Hf, Co, Al, Si, In, Cr, W and Mo. The bonding layer may derive from a structure of two or more layers. The conductive pad may comprise a bonded outer layer. The He hermeticity of the feedthrough may be less than 10-7 L atm/s.
priorityDate 2020-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8991680-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3299062-A1
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Total number of triples: 20.