| abstract |
A cooling system for memory modules for example dual in-line memory modules (DIMMs) supporting dual random access memory (DRAM) chips (Fig. 2; 24) on either side of a circuit board (Fig. 2; 22) comprises a heat conduction assembly 10 for each memory module 20 which allows conduction of heat in a direction parallel to a system board 12, from the memory modules to a pair of liquid-cooled mounting blocks 40, 140 located at opposing ends of parallel slot shaped sockets 30 for receiving the modules. Each heat conduction assembly includes a frame having opposing first and second supports 61, 62, first and second heat spreader plates 64, 65 each extending from the first support 61 to the second support 62, and a pair of fluid-filled flattened heat pipes 66 each extending along a respective one of the heat spreader plates. The liquid-cooled mounting blocks 40, 140 releasably support the heat conduction assemblies over the memory module sockets 30 with the memory module between the heat spreader plates so that the memory chips are in thermal engagement with the heat spreader plates 64, 65. |