| abstract |
A photoreactive resin composition comprises an inorganic powder comprising at least one of a polyvalent metal powder and a polyvalent metal oxide powder, an alkali-soluble polymer containing an ethylenically unsaturated double bond, an ethylenically unsaturated monomer, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain. The polyvalent metal powder preferably comprises copper powder coated with copper oxide. The second polymer is preferably polyvinylpyrrolidone or a copolymer thereof. The organic solvent preferably comprises a diol and the resin composition may also comprise a polyhydric alcohol having four or more hydroxide groups per molecule. Also claimed is a resin composition wherein average particle diameters for the inorganic powder, molecular weights and acid values for an alkali-soluble (meth)acrylic polymer, boiling points for the organic solvent and Fitkentsher viscosity vales of the pyrrolidone polymer are specified. Further claimed is a method of manufacturing a circuit board and ceramic multilayer substrate comprising the composition. |