| abstract |
A solder structure comprising a radially-curved exterior surface 26 enclosing a predetermined-sized cavity 28 is used for flexibly joining together at predetermined conductive contact points 30,32 two planar elements 14,18 having dissimilar properties. By assembling the two planar elements 14,18 in a tiered arrangement, with one planar element 14 having an annular conductive pad 30 and the other planar element 18 having either a corresponding annular or circular conductive pad 32 separated by a spherical solder compound, the compound comprising solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint. The solder structure may be spherical or cylindrical. |