| abstract |
A multilayer circuit component comprises at least two glass-containing layers (4a, 4b) on a substrate (1), in which circuit tracks (2a, 2b, 2c) are formed. A via hole (3b) is formed in the layers and filled with conductive filler (5) to connect tracks (2a, 2b). The at least two layers (4a, 4b) contain glasses in which the softening temperature of the glass compounded in the first layer (4a) is different to that of the glass compounded in the second layer (4b). The different softening temperatures of the glass layers reduces baking shrinkages between the layers such that the via holes maintain better shape during the manufacture process and short circuits are prevented between conductive tracks (2a-c) when the vias are filled with conductive filler. |