| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-3414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28568 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 |
| filingDate |
1999-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62846da65891324ee2a75d4b63d4b806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e40fa4dcc3397ad4446eccb3697dab8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c56181e29cf1de742cb6550c2f568e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ccc37c5b72c5919a060a22e36be462f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9947842570db37e9d650a2bef013da9a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5721ec6c6202ae169e76685c09658851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_284aef6f73aa4f118e6ab6bc6e587118 |
| publicationDate |
2001-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
GB-2359825-A |
| titleOfInvention |
Improved tantalum-containing barrier layers for copper using high purity tantalum targets for sputtering |
| priorityDate |
1998-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |