| abstract |
A thermosetting resin composition for use e.g. in making printed circuit boards comprises (A) an epoxy resin having two or more glycidyl groups, (B) a curing agent for epoxy resin, (C) a poly(ether sulfone) and (D) an inorganic filler. Alternatively, the composition comprises (A) an epoxy resin having two or more glycidyl groups, (B) a polyhydric phenol type curing agent for epoxy resin, e.g. a phenol novolac, cresol novolac, or phenol-modified polybutadiene, and (C) a poly(ether sulfone). |