| abstract |
A tape automated bonding process for attaching an integrated circuit to a printed circuit board comprises supplying energy to a bonding tool 8 arranged to press a lead 2 of the integrated circuit against the printed circuit board and monitoring the deformation of the lead. The level and duration of the supply of energy is continuously controlled during the bonding process in response to the deformation of the lead. The method is particularly appropriate for gold, gold-tin-copper or gold-tin-gold systems, and is carried out as a three stage process. <IMAGE> |