| abstract |
In a SAW device having a piezoelectric substrate (11) and interleaved metal electrodes (12, 12') formed on the substrate, the formation of the electrodes on the substrate is carried out by sputtering. Further, the metal electrodes may contain an additive of Cu, Ti, Zn, Mg, Fe, Ni, Cr, Ga, Ge, Sn, Pd or Ta. The resulting SAW device is capable of dealing with high frequency electric signals of a larger amplitude, or higher power electric signals, as compared with the conventional SAW device. <IMAGE> |