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filingDate 1983-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1986-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fc36d330c8caedbf5aa292d722ddd44
publicationDate 1986-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-2143759-B
titleOfInvention Method of laser soldering
abstract A method of soldering electrical lead strands (13) (of a width at least .3 inch) to a printed electrical path. The path is planted on an alumina ceramic substrate (15) and a solder pad (24) is attached to a portion of the path. A flat surface portion of each lead strand (13) is forced into full interengagement with a pad (24), a CO2 defocused laser beam (28) is directed onto the soldering assembly with the beam (28) controlled to have a beam power of at least 100 watts, a beam spot diameter (27) no less than the width of the lead strand (13) and no greater than the width of the pad (24), and a beam on-time effective to exert a controlled thermal radius on the soldering assembly to reflow only a preselected portion of the pad (24) and effect a solder joint between the pad (24) and strand portion (13), the joint having a strength of at least 400 grams.
priorityDate 1983-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 36.