Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac93f643b44e958763fd1234fe359e3f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85214 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10984 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10189 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3421 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005 |
filingDate |
1983-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1986-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fc36d330c8caedbf5aa292d722ddd44 |
publicationDate |
1986-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
GB-2143759-B |
titleOfInvention |
Method of laser soldering |
abstract |
A method of soldering electrical lead strands (13) (of a width at least .3 inch) to a printed electrical path. The path is planted on an alumina ceramic substrate (15) and a solder pad (24) is attached to a portion of the path. A flat surface portion of each lead strand (13) is forced into full interengagement with a pad (24), a CO2 defocused laser beam (28) is directed onto the soldering assembly with the beam (28) controlled to have a beam power of at least 100 watts, a beam spot diameter (27) no less than the width of the lead strand (13) and no greater than the width of the pad (24), and a beam on-time effective to exert a controlled thermal radius on the soldering assembly to reflow only a preselected portion of the pad (24) and effect a solder joint between the pad (24) and strand portion (13), the joint having a strength of at least 400 grams. |
priorityDate |
1983-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |