| abstract |
The invention provides a thermoplastic, epoxy pendant, urethane-containing compound which is the reaction product of an epoxy resin containing more than one, preferably two hydroxyl groups and a polyisocyanate, preferably a diisocyanate. The compound is formed in the presence of a heat reactive epoxy curing agent resulting in a one component material usable as a thermoset adhesive, sealant or coating on heating. The curing may be carried out using electromagnetic heating, e.g. induction or dielectric heating. |