| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6ccf29dc5e0c8fd7d278568b1db2b0b1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-165 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-16 |
| filingDate |
1981-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1982-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
GB-2090072-A |
| titleOfInvention |
Package for Electronic Components |
| abstract |
A DIL pack is constructed in part from glass fibre reinforced resin. As shown the pack has a ceramic base 10 on which are mounted circuit components 12 and a lead frame 14, the ceramic base 10 having printed thereon conductors connected to the circuit components and the lead frame 14. A glass fibre reinforced resin ring frame 20 is adhered to the base 14 and has adhered to it a lid 24. <IMAGE> |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6011697-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4682207-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6184589-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2702921-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5879786-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9820547-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2758935-A1 |
| priorityDate |
1980-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |