http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2079539-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5ed4f178583c34e27eabf0d899c20b4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-016 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-01 |
| filingDate | 1981-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1982-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-2079539-A |
| titleOfInvention | Electrical circuit assemblies |
| abstract | A thin film circuit assembly comprises a conductive aluminum layer 14 supported directly or indirectly by a resistive layer 12 and electrical interconnection members 24 bonded directly to the aluminium by ultrasonic or thermocompression bonding techniques. <IMAGE> |
| priorityDate | 1980-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.