http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1514595-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e08fd85d97265d6c31ab40f372843d81 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate | 1976-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1978-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-1514595-A |
| titleOfInvention | Package for hermetically sealing electronic circuits |
| abstract | 1514595 Electric circuit assemblies HUGHES AIRCRAFT CO 9 Feb 1976 [3 March 1975] 04946/76 Heading H1R A module 10 (Fig. 1) supporting an integrated circuit wafer 12 is supported on a substrate 14 (Figs. 2a, 2b) of, e.g. ceramic material, which comprises a printed circuit board with radial leads 16 or pins 18 intersecting the base. Exterior leads 24 connect these to a multipin plug connector 26 connecting to a system (not shown). Substrate 14 is, e.g. adhesively bonded to frame 30 screwed to connector 26. A cooling fan system (not shown) is carried by the reverse side of the substrate. A sealing ring 34 is hermetically bonded to a metallized area of the substrate and has a sealing area 38 to which a lid 40 is hermetically bonded to form a sealed package. This may take the form of a ceramic ring 42 (Figs. 2a, 2b) brazed at 44 to substrate 14; and metallised at 46 for brazing to a metal ring 48 extending upwardly to define a sealing area 52 for ceramic lid 54 resting on surface 50 of ring 42 and bonded to the sealing area by solder fillet 56. The ring 48 may be swaged over at 58. In modifications (Figs. 3 to 5, not shown) a metal ring of L cross section is spaced from the sealing ring and solder fillet bonded to the lid and brazed to the ceramic substrate directly or over the radial leads, and a ceramic spacer or a layer of dielectric coating may be interposed for insulation. Alternatively (Figs. 6, 7, not shown) the L-shaped ring may have its base turned inwardly and bonded to the substrate directly or through a dielectric coating while the sealing ring is brazed to the upper side of the base member to form a sandwich. The lid may be of metal for, e.g. magnetic shielding to have a domed configuration and an upturned edge soldered to the upward extension of the L- shaped ring. Alternatively (Fig. 8, not shown) the metal ring may be of U-shaped cross section with upstanding portions joined by a base which is brazed to the substrate with the outer upstand soldered to the lid while the inner upstand replaces the ceramic ring. The coefficient of thermal expansion of the ceramic ring and the metal ring should be matched, while the ceramic ring and lid may be of similar composition to the substrate. The metallized sealing surfaces may be of tungsten or molybdenum, and the cavity may be gas filled. |
| priorityDate | 1975-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.