http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1508324-A

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filingDate 1975-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1978-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-1508324-A
titleOfInvention Moulds for encapsulating
abstract 1508324 Mould for encapsulation CIBAGEIGY AG 12 May 1976 [4 June 1975] 24062/75 Heading B5A A component 13 (e.g. a coil, resistor or ceramic capacitor) is encapsulated in a thermosetting resin within a mould comprising a rigid outer casing 1-3 defining a mould cavity, and at least one pair of opposing flexible plugs 7/8 that grip the component between them. The plug material (e.g. nylon, PTFE, polyethylene, flexible thermosplastics polyurethane, polypropylene or silicone rubber, perhaps embedding metal portions) has a higher coefficient of expansion than that of the outer casing (e.g. aluminium, iron, steel or an epoxide resin with a mineral, aluminium or iron filler). The outer casing comprises two sections or three 1-3 and metal plates 11/12, held together by bolts 4/5 or toggle catches. At least one plug 8 is movable inwardly by a screw 9 and aluminium disc 10, and several components 13 can be supported simultaneously by several pairs of plugs. In use, a component 13 is held by the plugs 7/8 in the silicone release agent coated casing 1-3, which is heated. The mould is evacuated, and a heated thermosetting resin (e.g. phenolformaldehyde, polyurethane, alkyd, polyester, silicone or epoxide resin with colouring, filler and curing agent) is sucked in through holes 14/15. After curing in the mould under heat, the holes in the encapsulated component made by the plugs 7/8 are filled or used for contacts.
priorityDate 1975-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 22.