http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1508324-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e9445e5e3626f36e932c6451a928250 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-00 |
filingDate | 1975-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 1978-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | GB-1508324-A |
titleOfInvention | Moulds for encapsulating |
abstract | 1508324 Mould for encapsulation CIBAGEIGY AG 12 May 1976 [4 June 1975] 24062/75 Heading B5A A component 13 (e.g. a coil, resistor or ceramic capacitor) is encapsulated in a thermosetting resin within a mould comprising a rigid outer casing 1-3 defining a mould cavity, and at least one pair of opposing flexible plugs 7/8 that grip the component between them. The plug material (e.g. nylon, PTFE, polyethylene, flexible thermosplastics polyurethane, polypropylene or silicone rubber, perhaps embedding metal portions) has a higher coefficient of expansion than that of the outer casing (e.g. aluminium, iron, steel or an epoxide resin with a mineral, aluminium or iron filler). The outer casing comprises two sections or three 1-3 and metal plates 11/12, held together by bolts 4/5 or toggle catches. At least one plug 8 is movable inwardly by a screw 9 and aluminium disc 10, and several components 13 can be supported simultaneously by several pairs of plugs. In use, a component 13 is held by the plugs 7/8 in the silicone release agent coated casing 1-3, which is heated. The mould is evacuated, and a heated thermosetting resin (e.g. phenolformaldehyde, polyurethane, alkyd, polyester, silicone or epoxide resin with colouring, filler and curing agent) is sucked in through holes 14/15. After curing in the mould under heat, the holes in the encapsulated component made by the plugs 7/8 are filled or used for contacts. |
priorityDate | 1975-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.