http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1418949-A
Outgoing Links
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| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
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| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3164 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate | 1973-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1975-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-1418949-A |
| titleOfInvention | Electrical component assemblies |
| abstract | 1418949 Capacitors; semiconductor devices; resistors; component assemblies SIEMENS AG 30 Nov 1973 [30 Jan 1973] 55547/73 Headings H1K H1M H1R and H1S An electrical component or component assembly 1 having lead wires 2, 3 extending in the same direction is encased by thermoforming a synthetic resin foil to conform to the shape of the component or assembly and to provide a space for receiving hardenable potting resin 5 to complete a moisture-tight envelope. The foil may be polycarbonate, polyethylene, polypropylene or polysulphone, or a laminate wherein one resin is selected for its good bonding to the potting material, the other for its moisture-proofness. The eventual outer surface may be coated with aluminium by vapour deposition. A plurality of components may be encased simultaneously by placing each on a projection on a holding plate, the projection corresponding to the potting space (Fig. 2, not shown). The lead wires pass through holes in the plate, which also has holes for withdrawing air to draw heated resin foil around the components and projections. The plate is removed and components separated and the potting material introduced. The envelope may be formed so as to provide feet 6, 7 for spacing the component when mounted on a printed circuit board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10834827-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0203460-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0203460-A2 |
| priorityDate | 1973-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 |
Total number of triples: 30.