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filingDate 1973-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1975-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-1401600-A
titleOfInvention Composition and process for the activation of resinous bodies for adherent metallization
abstract 1401600 Electroless plating of resinous surfaces KOLLMORGEN CORP 7 Dec 1973 [13 Dec 1972] 56730/73 Heading C7F A resinous surface of e.g. a.b.s. or polyester is contacted with an aqueous solution of K, NaCa, Li or Cs permanganate having a molar ratio of permanganate ion to manganate ion of up to 1.2 and a pH of 4 to 13 prior to electroless plating with e.g. Cu, Au, Ag, Co or Ni. The surface may contain copper oxide or may be contacted with stannous and then Pd or Pt chlorides. The surface may be pre-treated by contacting with dimethyl formamide, dimethyl sulphoxide, N- methyl-2-pyrrolidone, ketones, halogenated hydrocarbons, sulphuric, nitric or phosphoric acids, toluene sulphonic acid or a strong amine. After contacting with the permanganate, the solution on the substrate may be neutralized with stannous ions, bisulphite ions, sugar or hydroxylamine. The permanganate solution may be rejuvenated by bubbling CO 2 therethrough, heating to 80 to 100‹C, cooling, adding calcium hydroxide or oxide, and filtering.
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