http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1390752-A
Outgoing Links
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| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4828 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 1972-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1975-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-1390752-A |
| titleOfInvention | Lead frames for holding and contacting semiconductor bodies |
| abstract | 1390752 Semi-conductor lead assemblies SIEMENS AG 25 May 1972 [3 June 1971] 51251/73 Divided out of 1389346 Heading H1K A process for the production of a lead frame, of the type having inwardly directed leads in the form of tongues for connection to semiconductor body electrodes and outer terminal legs each connected to one of the leads and being thicker than the leads and made of a different metal therefrom, comprises etching the inner leads and outer legs from a two-layer or multi-layer metallic material using appropriate etching masks, the various layers consisting of different metals having different etching resistances to the etchant or etchants. The multi-layer metallic material may comprise a relatively thicker brass layer 15 for forming the outer legs and a relatively thinner nickel layer 14 for forming the inner leads which may be bow-shaped. Etching is now carried out through photolithographically applied masks on each layer using an etching medium which attacks the nickel less than the brass in accordance with the greater thickness of the brass layer 15. Alternatively two selective etchants each of which attacks one only of the metals may be used. The semiconductor chip 16 can be mounted either side of the frame and subsequently embedded in a synthetic resin block. |
| priorityDate | 1971-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935 |
Total number of triples: 30.