http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1377515-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_592ecc4fd30a3ecbc69f338002ba18b4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate | 1971-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1974-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-1377515-A |
| titleOfInvention | Process for the depostion of metal laywers on shaped articles of polyesters |
| abstract | 1377515 Photo-resist materials KALLE A G 15 Dec 1971 [17 Dec 1970] 58245/71 Heading G2C [Also in Division C7 and H1] In the manufacture of printed circuits, (A) a polyethylene terephthalate film is (1) degreased (2) treated with a solution of PdCl 2 and trichloroacetic acid (3) dried, (4) treated with a solution of NaOH and hydrazine hydrate (5) electrolessly plated in a Cu-HCHO bath (b) electrolytically thickened with Cu from a CuSO 4 bath (7) coated with a napththoquinone diazide photoresist containing a novolak and polyvinylacetate (see Example 3), exposed and developed with Na 3 PO 4 and ethylene gylcol methyl ether, (8) the bared Cu is removed by etching and (9) the photoresist is removed by solvent to leave a positive printed circuit. Alternatively, (B) A substrate is coppered using steps (A) (1) to (5) and photographically treated as at (7); one part of the board is etched and the photo-resist removed as at (8) and (9), and the remaining Cu thickened as at (6) to give a positive printed circuit; (C) the other part of the board, after steps (1) to (5) and (7) is thickened as at (6) on the bared Cu areas, and decoated (9) and etched (8) to give a negative printed circuit. Alternatively (D), procedure (C) is repeated by thickening with electrolytic Ni instead of Cu as in step (6). In Example 8, a polyethylene terephthalate film is coated with a photopolymerizable material, coated with polyethlene terephthalate by pressure rollers, the laminate is exposed, the covering film pulled off, and the photopolymer layer developed; the resulting body is degreased, neutralized, treated using steps (A) (2) to (5), the etch resist is removed by wiping with methylene chloride, and the Cu film is thickened as at A (6) to give a positive circuit diagram. |
| priorityDate | 1970-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.