| abstract |
1334998 Semi-conductor device enclosures DIACON Inc 17 Aug 1972 [24 Sept 1971] 38468/72 Heading H1K An enclosure for a semi-conductor device comprises a substrate 1, e.g. of metal or ceramic material including a cavity 4 for the device wafer, on which is formed a composite glass layer having a lower devitrified portion 7 and an upper non-devitrified portion 8, conductive leads 2, e.g. forming parts of a lead frame, being embedded in and extending through the glass layer 7/8. A ceramic lid optionally carrying a non-devitrified glass coating is provided to seal the enclosure. During the sealing process the upper portion 8 of the composite glass layer is devitrified. |