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filingDate 1970-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1973-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-1330678-A
titleOfInvention Bath for the chemical metallization of non-conductive materials
abstract 1330678 Electroless Co and/or Ni plating BAYER AG 8 Oct 1970 [9 Oct 1969] 47841/70 Heading C7F An aqueous electroless Co and/or Ni bath usable at 15-45‹C comprises (a) a Ni and/or Co salt (b) a complex former (c) a buffer (d) a stabilizer (e) a reducing agent and (f) glycolic and/or lactic acid or their alkali metal and/or ammonium salts and has pH 7-10. Typically, (a) is a chloride or sulphate (b) is Na citrate, Na tartrate, NH 4 succinate or Na malonate, in amount 0À1-2 moles per total mole of plating metal (mol/m) (c) is Na acetate, Na borate or an NH 4 salt of an inorganic acid, amount 0À5-4 mol/m (d) is Pb acetate, TI 2 SO 4 , thiourea, SlO 2 , or thioglycollic acid, 1-1000 mg/l, (e) is NaH 2 PO 2 or a boron hydride compound such as N-dimethylborazane or N- diethylborazane, and (f) is used in amount 1-4 mol/m. The pH is adjusted with alkali metal or ammonium hydroxide; the substrate may be ABS plastic which is first pickled in chromosulphuric acid, treated in HCl, activated with Pd salt and treated with aqueous reducing agent. The electroless coating, whose P or B content is lower than that produced by conventional baths, may be coated with electrolytic Cu, which may be followed by electrolytic semi-bright Ni, bright Ni and Cr.
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priorityDate 1969-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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