http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1266193-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03C5-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C5-58 |
| filingDate | 1969-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1972-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-1266193-A |
| abstract | 1,266,193. Coating with metals. WESTERN ELECTRIC CO. Inc. April 8, 1969 [April 9, 1968], No. 17810/69. Heading C7B and C7F. A metal pattern, e. g. a printed circuit, is formed on a substrate by coating with a solution containing metal ions whose oxidation state is alterable by exposure to ultraviolet radiation less than 3, 000 A, exposing the ions to such a radiation to form a pattern of metal ions capable of reducing catalytic metal ions selected from Au, Ir, Os, Pd, Pt, Rh, and Ag, and then immersing the substrate in a solution of a salt of the catalytic metal. The substrate is then electroless-plated with Cu, Ni, Co, Pt, Pd, Au or Ag. The substrate may be polyimide, polyamide, silicone or epoxy films, unfired or fixed ceramics, paper, cloth or glass fibre. The ultraviolet sensitive solution may be such as to give a positive or negative pattern. Examples of negative solutions are ferric oxalate, citrate or tartrate or mercuric oxalate, citrate or tartrate. Examples of positive solutions are tin, tinanium or lead chlorides or bromides. As shown in Fig. 2 a substrate 11 is fed through a cleaner 12, water rinse 13, ultraviolet sensitive solution 14, dried by air from nozzles 46, optional water rinse 16, exposure to radiation, through a mask, from ultraviolet sources 48, 49, immersion in precious metal salt solution 19, water rinse 21, electroless-plating bath 20, electro-plating bath 22, final water rinse 23, and drier 62. The electroless bath may contain hydrazine, formaldehyde, sodium hypophosphite or boranes as reducing agents and E. D. T. A., cyanides or Rochelle salts as complexing agents. The electro-plating bath may be copper fluoborate or sulphate and the substrate is connected to a negative potential through a roller 32. The anode 86 may have an angled part 90 to decrease the current density during entry. The plated substrate may be subsequently heated. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2196022-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2196022-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2225028-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2225028-A |
| priorityDate | 1968-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.