http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1263445-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b76764147007afa3a805eba32b898487
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
filingDate 1970-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1972-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-1263445-A
titleOfInvention Ductility promoter and stabilizer for electroless plating baths
abstract 1,263,445. Electroless plating. PHOTO- CIRCUITS CORP. Jan.28, 1970 [Feb.4, 1969], No.4211/70. Heading C7F. An electroless plating solution comprises water, a complexing agent, a reducing agent and a stabilizing agent for the metal ion to be deposited, a pH adjuster, and an amount of a polyalkylene oxide insufficient to prevent electroless deposition of metal but sufficient to enhance the stability of the solution, said amount being in the range 0À1 to 80 mg/l. The polyalkylene oxide preferably has MW 6000-6,000,000 and may be polyethylene oxide, polypropylene oxide or polybutylene oxide. The metal may be Cu, the reducing agents may be formaldehyde, paraformaldehyde, trioxane, dimethyl hydantoin, glyoxal, Na or K borohydride, Na trimethoxy-borohydride, boranes, or amine boranes and the stabilizing agent may be NaCN or 2-mercapto-benzothiazole.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-2610470-A1
priorityDate 1969-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.