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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67115
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
filingDate 1969-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6481531b63e86739d60f58db5fe083b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2eb306acdad73e62c7d303682ede505
publicationDate 1971-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-1246207-A
titleOfInvention Selective depolymerization of thin polymer films
abstract 1,246,207. Etching. GENERAL ELECTRIC CO. 12 May, 1969 [22 May, 1968], No. 24173/69. Heading B6J. [Also in Divisions B1, C3 and G2] Metal layers which have photographically produced polymeric masks thereon (see Division G2) are etched with the following etchants: Silver etched with chromium trioxide and sulphuric acid in water; Copper etched with (a) 2À25-3À75M ferric chloride or (b) ammonium persulphate and mercuric chloride in water; Aluminium etched with (a) 5N potassium hydroxide and potassium bromate (b) hydrochloric acid and copper carbonate (c) stannous chlorate in water followed by concentrated hydrochloric acid and nickelous chloride or (d) 20% caustic soda; Tin etched with hydrochloric and nitric acid in water; Lead etched with (a) citric acid and hydrogen peroxide in water or (b) acetic acid and hydrogen peroxide in water; Gold etched with (a) iodine and potassium iodide in water or (b) photoetched with methyl iodide during exposure to ultra-violet light.
priorityDate 1968-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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