| abstract |
1,243,097. Semi-conductor devices. INTERNATIONAL COMPUTERS Ltd. 23 Feb., 1970 [12 March, 1969], No. 12927/69. Heading H1K. A method of producing a pattern of electrical connectors on an integrated circuit 1 comprises forming a pattern of conductive areas 2 on one surface of the circuit 1 and also forming a corresponding pattern of pillars 3 of conductive material on a temporary substrate 4, aligning the circuit 1 and substrate 4 so that the pillars contact the areas 2, and conductively bonding the pillars to the areas 2 subsequently removing the substrate 4. The pillars 3 may be of tin/lead alloy, and capped with gold on one or both ends. They may be formed by deposition of material through an apertured mask. The substrate 4 may be of oxidized stainless steel. Ultrasonic bonding may be used to bond areas 2 to pillars 3. |