http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1189074-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49073 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F17-0033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F17-06 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-06 |
filingDate | 1968-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 1970-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | GB-1189074-A |
titleOfInvention | Apparatus for Electroplating Metal or Alloy Films |
abstract | 1,189,074. Electro-plating apparatus. INTERNATIONAL BUSINESS MACHINES CORP. Nov. 11, 1968 [Dec. 26, 1967], No.53255/68. Heading C7B. Apparatus for electro-plating metal or alloy films, particularly a Ni-Fe-Cu magnetic alloy film, comprises a container 10, e.g. of glass or plastic such as polymethacrylate, for a plating bath, in which an anode 24, e. g. of Mo, Ni or Pt, and a cathode 14, e.g. a conductive sheet of Cu, Ag, Ni, Co or Au on an insulating board, are arranged and selectively masked, by dielectric material, e. g. on their edges by dielectric container walls, to provide uniform current density at the cathode and thus no variation in film thickness or composition during electro-plating. The electrodes may be mounted one above the other, as shown in Fig. 2a, or vertically Fig. 2b (not shown) with their three edges in contact with the dielectric container walls and their fourth edge in contact with air as dielectric. The bath may be mounted inside Helmholz coils 12 and agitated during plating by moving one of the electrodes relative to the other or a carrier 34 back and forth by a motor 32 via linkage 36, or by flowing solution. For increasing the surface area of the anode 24 to prevent anodic oxidation deposits forming, a wire winding 26 of the same material may be wound around, or the anode may be corrugated or grooved. For uniformly plating a wire, as shown in Fig. 4, the wire 14 continuously passes by rollers 31 through a perforated hollow cylindrical anode 24, the ends of which are enclosed by dielectric discs 27 to prevent current spreading. Baths are specified containing: (1) NiSO 4 , FeSO 4 , with or without CuSO 4 , saccharin, sulphamic acid and KNa tartrate; (2) NiCl 2 , FeCl 2 , H 3 BO 3 , saccharin and Na lauryl sulphate; and (3) Cu(NO 3 ) 2 , H 2 SO 2 , formic and acetic acids. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108893771-A |
priorityDate | 1967-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.