| abstract |
1,164,049. Epoxy resin composition. SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ N.V. 22 Dec., 1967 [27 Dec., 1966 (3)], No. 58329/67. Heading C3B. A heat-curable composition comprises: (A) an adduct, of a polyepoxide and an amine having at least two amino hydrogen atoms, which is acetone soluble, has a softening point of 79-125‹ C. and an epoxy equivalent of 400 to 932; and (B) from 0.5 to 6% by wt. of (A) of an imidazole compound, e.g. imidazole itself or imidazole lactate. (A) may be an adduct of a polyglycidyl ether of bisphenol A with e.g. aniline, diaminodiphenyl methane, or a mixture of aniline and meta-aminophenol. The compositions may be in the form of powders when they may be used for moulding or fluidized bed coatings. Solutions of the compositions may also be used in coatings. Curing may take place at 138-232‹ C. |