http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1141047-A
Outgoing Links
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5635744f3e22ca8d710dd1f2707bee23 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2893-0035 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C29-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J5-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-24 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J5-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C29-00 |
filingDate | 1966-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 1969-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | GB-1141047-A |
titleOfInvention | Improved hermetic enclosure and method of manufacture |
abstract | 1,141,047. Glass to metal seals. CORNING GLASS WORKS. 22 April, 1966 [29 April, 1965], No. 17797/66. Heading C1M. [Also in Division H1] An hermetic enclosure-e.g. for semi-conductor diodes, transistors or silicon integrated circuits-consists of a metallic plate 12 with flanged sidewall portions 25 defining a cavity, and apertures in the base of this cavity are surrounded by collets 22 formed by material extruded from the plate. Resting on the plate is a body 14 of fusible non-conductive material with protruding bushes 26 which fit into the collets 22. Lead-out wires 28 for connection to the device or devices to be housed in the enclosure are passed through these bushes. The body 14 is fusion-sealed to the plate 12 and to the leads 28 and the enclosure is completed by a metallic cover 30 with flanges 32 which are sealed to the flanges 25 of the plate 22. The preferred material for the body 14 is glass, specifically a glass of the following composition: 57% (by weight) SiO 2 , 30% PbO, 8% K 2 O, 4% Na 2 O, 1% Al 2 O 3 . The preferred material for the metallic housing parts is copperclad mild steel and for the wires 28 a copperclad nickel-iron alloy, 'Dumet'. The thermal expansion coefficient of the steel is greater than that of the glass so after heating to seal the glass to the metal, the metal contracts more than the glass during cooling and so places the bushes in radial compression. The sealing is performed in a jig (not shown), preferably of boron nitride, which holds plate 12, body 14 and leads 28 in the required relative position. After the sealing step, and securing the devices to the leads, the cover 30 is sealed to the plate 12 by welding. Figs. 1 and 5 (not shown) depict plan views of two alternative forms of the plate 12, both of which provide more than one cavity for a glass body and associated leads, so that in each case a single mounting provides a plurality of separate enclosures. |
priorityDate | 1965-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.