http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-1101770-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3492a7406879265b1f567f37d98dbbaf |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S257-926 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-26 |
| filingDate | 1966-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1968-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | GB-1101770-A |
| titleOfInvention | Compression bond encapsulation structure with integral caseweld ring |
| abstract | 1,101,770. Semi-conductor device. WESTINGHOUSE ELECTRIC CORPORATION. 24 May, 1966 [14 June, 1965], No. 23011/66. Heading H1K. A heat-dissipating support member 12 of Cu, Al, Ag, alloys thereof or ferrous alloys, has a ferrous alloy cylinder 26 brazed thereto. The semi-conductor stack 36 consists of a Mo electrode 42, a semi-conductor wafer 38 having at least one PN junction, a layer 44 of hard or soft solder, e.g. Au or Ag based solder, an electrode 40 of Mo, W, Ta or alloys thereof and a layer 46 of Au, Ag, Al or Sn. The layer 46 may be formed by electrodeposition. Electrical conductors 48 and 50 are connected to the stack but are insulated by a layer of fluorocarbon 52. Two conductors are used for an SCR but in a simple diode rectifier only one electrode (48) is employed. An insulating washer 54 of ceramic, mica, glass, quartz or fluorocarbon and a thrust washer 56 are situated around but insulated from the conductor. At least one spring washer 58 is mounted on the stack and a snap-ring 60 retained in groove 30 holds the spring under pressure. The easing is hermetically sealed using an insulating cap 66 which is welded by member 64 to the cylinder 26. In an alternative embodiment (Fig. 3, not shown), both conductors 48 and 50 are offset and an insulating sleeve (72) isolates the stack from the cylinder 26. The sleeve (72) may be a molecular sieve and together with another sleeve (74) situated above the ring 60, acts as a moisture and gaseous gettering material. The surface of the cylinder 26 may have flats on it. |
| priorityDate | 1965-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.