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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12
filingDate 1965-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1967-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-1069970-A
titleOfInvention Improvements in or relating to electro-plating processes
abstract A nickel or copper plating bath comprises an aqueous acid solution containing a soluble nickel or copper compound, e.g. a chloride, sulphate and/or fluoborate, and at least one unsaturated organic sulphamide compound of the formula R1R2N - SO2 - N R3R4 wherein the substituents R1 to R4 are the same or different and each represent H, an alkenyl radical with 2 to 6 C atoms, an aryl, halogenated aryl, aralkyl or alkaryl radical or a group of the formula -R-SO3-or -R-(EtO)- where R represents an unsaturated hydrocarbon radical with 1 to 4 C atoms, not more than three of the substituents being H. Examples of the sulphamides are: monoallyl or sym. diallyl sulphamide; phenyl-, chlorobenzyl-, b -phenylvinyl- or vinylbenzyl-sulphamide; Na-3-sulphonylpropen-1-yl-sulphamide; and polyethoxy derivatives of unsaturated sulphamides such as HO-(CH2-CH2-O)2-(CH2.C­C)-NH-SO2 -NH2. Boric or formic acid may be added to the bath together with secondary brighteners such as esters of sulphocarboxylic acids 2-butyne-1, 4 diol diester. The bath may be used for electrodepositing Ni or Cu on to steel plate using a current density of 0.5 - 100 A.S.F.
priorityDate 1964-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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