http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3040108-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76259 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-311 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-98 |
| filingDate | 2015-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d27edad7afc5084aeb31965b863edf1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c75f941f39dd50394a956d8653d5558 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2746af6605dc13deeec60d445fcab903 |
| publicationDate | 2017-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | FR-3040108-A1 |
| titleOfInvention | METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE WITH TEMPORARY DIRECT COLLAGE OPERATING A POROUS LAYER |
| abstract | The invention relates to a method for manufacturing a semiconductor structure, comprising the steps of: direct bonding of a substrate to be handled (1) with a handle substrate (2) via a bonding layer ( 3) covering the handle substrate, to form a temporary structure capable of being subjected to technological steps; and dismantling the temporary structure at the level of the bonding layer to separate the substrate to be handled (1) from the handle substrate (2), characterized in that it comprises a preliminary step of depositing the bonding layer (3). ) on the handle substrate (2) and / or on the substrate to be handled (1), the bonding layer (3) being made of a porous material formed of an inorganic matrix and organic compounds connected or not to this matrix, and in that the disassembly step is carried out by providing a disassembly thermal budget to the intermediate structure (6, 16), said contribution resulting in a spontaneous disassembly of the temporary structure intervening at the level of the bonding layer. |
| priorityDate | 2015-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.