| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7443f9fa412762a1a5ba8390a27fc5e3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B29-00 |
| filingDate |
2015-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd4eac8c6bc819600922ce62e113e297
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61f2e703ea06ca57618c0e746aca8db2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7687455ba2f04b0fee8c5a4c35752cdf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_165ce8a8bca8b6813e516fed8f22e7c1 |
| publicationDate |
2020-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
FR-3024064-B1 |
| titleOfInvention |
PROCESS FOR THE MECHANICAL CHEMICAL POLISHING OF RUTHENIUM AND COPPER-CONTAINING SUBSTRATES |
| abstract |
A method is provided for chemical mechanical polishing of a substrate comprising ruthenium and copper. |
| priorityDate |
2014-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |