| abstract |
The invention relates to a method of assembly of Flip-Chip type, between a first (1) and a second (2) components each having connection pads (11, 21) on one of their faces, said assembly faces , according to which the components are reported to one another by their assembly faces so as to achieve electrical interconnections between the pads of the first and those of the second component. According to the invention, a conversion of copper oxide to copper is carried out by UV annealing, very locally in the spacing between components at least around the zones to the right of the connection pads. The process according to the invention can be used for any UV-transparent component, including for plastic substrates such as PEN or PET substrates. |