| abstract |
The invention relates to a flip-chip assembly method, two microelectronic components (1,2) to one another. According to the invention, provision is made either to dimension shims (24) in addition to the interconnection protuberances (22) or to oversize the latter so that their deformation returns to elasticity once the assembly contact between components (1 , 2) reaches, after being plastic when inserted by inserts (12) connection. Thanks to the invention, one can control very finely the spacing between the two components during their assembly and this without adding additional step to their manufacture or the assembly process. |