| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5a65afd2c0d431385c1f67a0660a28e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9202
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24146 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate |
2009-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99eb370ec1b641b3a6ddfaf2138b44e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e897bb983002258d6f4849db415744e1 |
| publicationDate |
2011-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
FR-2948496-A1 |
| titleOfInvention |
VIA ELECTRIC WITH A ROUGH SIDE SURFACE |
| abstract |
The invention relates to a via (23) connecting the front face to the rear face of a semiconductor substrate (W1), via via a rough side surface. |
| priorityDate |
2009-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |