| abstract |
A method of bonding a first copper element to a second copper element comprising a step of forming an oxygen-enriched copper crystalline layer on each of the surfaces of each of the first and second elements by which the elements will be exposed. contact, the total thickness of the two layers being less than 6 nm, said step comprising: a) at least one step of polishing the surfaces so as to obtain a roughness of less than 1 nm RMS, and hydrophilic surfaces; b) at least one step of cleaning said surfaces to remove the presence of particles due to polishing and most of the corrosion inhibitors; c) a step of bringing the two oxygen-enriched copper crystalline layers into contact with each other |