| abstract |
The invention relates to a method for manufacturing a reconstituted plate (1) which comprises chips (10) having connection pads (11) on one face of said front face chip (12), said method comprising the following steps of: - positioning of the chips (10) on an adhesive support (20), front face on the support, - deposition of a resin (50) on the support (20) to encapsulate the chips, - polymerization of the resin (50) ). Before the step of depositing the resin, it comprises a step of sticking on the chips of a plate for holding (40) the positioning of the chips, this holding plate (40) comprising portions arranged on one face (12, 13) chips. |