| abstract |
The invention relates to a method for collectively bonding individual chips to a stress substrate (44), which comprises the following steps: - the functionalized layers (40) are arranged on a support (41), adjacent to each other in a non-contiguous manner, with a spacing e between two adjacent layers (40), - a drop of calibrated glue (43) is deposited on each of these functionalized layers, - the stress substrate (44) is transferred to these drops of glue, - parts are singled out of the assembly thus formed for producing chips (45) bonded to the surface of the stress substrate.The invention also relates to a method of stressing a semiconductor readout circuit by a substrate made of a coefficient of expansion material different. |