| abstract |
The invention relates to a method for improving the mechanical strength of bonding between substrates when these bondings are made by means of an adhesive which comprises a resin which can be hardened by chain polymerization, and in particular a curable resin under effect of a light or ionizing radiation.This method is characterized in that it comprises the grafting on the surface of the substrates, before they are brought into contact with the adhesive, groups capable of serving as agents. chain transfer during the polymerization of said resin.Applications: assemblies of structural parts, engine, cockpit or bodywork in the aerospace, space, rail, naval and automotive industries. |