http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2899600-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-40
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
filingDate 2006-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2376a01205120e82572572f67d4acc4b
publicationDate 2007-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber FR-2899600-A1
titleOfInvention SURFACE-CONDITIONAL CONDITIONAL INHIBITORS FOR THE ELECTROLYTIC DEPOSITION OF COPPER ON A SURFACE
abstract Electrolytes for the electrolytic deposition of copper comprising, as an inhibitor, a poly (alkylene-biguanide) salt The inhibition developed by the poly (alkylene-biguanide) salts is conditioned by the concentration of an accelerator on the surface of the The surface-active nature of the poly (alkylene-biguanide) salts makes it possible to transfer them instantaneously from the electrolyte-air interface to the electrolyte-copper interface when the cathode and the electrolyte come into contact with one another.The electrolytes according to the invention are suitable for obtaining smooth and shiny electrolytic deposits, and for depositing copper on surfaces having submicron concavities useful in microelectronics.
priorityDate 2006-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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