http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2899600-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9bc10ea97b626b2042ca225ad751c68f |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
filingDate | 2006-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2376a01205120e82572572f67d4acc4b |
publicationDate | 2007-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | FR-2899600-A1 |
titleOfInvention | SURFACE-CONDITIONAL CONDITIONAL INHIBITORS FOR THE ELECTROLYTIC DEPOSITION OF COPPER ON A SURFACE |
abstract | Electrolytes for the electrolytic deposition of copper comprising, as an inhibitor, a poly (alkylene-biguanide) salt The inhibition developed by the poly (alkylene-biguanide) salts is conditioned by the concentration of an accelerator on the surface of the The surface-active nature of the poly (alkylene-biguanide) salts makes it possible to transfer them instantaneously from the electrolyte-air interface to the electrolyte-copper interface when the cathode and the electrolyte come into contact with one another.The electrolytes according to the invention are suitable for obtaining smooth and shiny electrolytic deposits, and for depositing copper on surfaces having submicron concavities useful in microelectronics. |
priorityDate | 2006-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.