| abstract |
The invention relates to an aqueous suspension useful for the chemical mechanical polishing of a semiconductor substrate having copper interconnections, which comprises, in percentage by mass, 0.01 to 25 of oxidizing agent, 0.1 to 50 particles. abrasive, 0.001 to 3 polyvinylpyrrolidone, 0.01 to 10 inhibitor to decrease the static etching of copper interconnects, 0.001 to 5 phosphorus-containing compound to increase the withdrawal rate of copper interconnects, 0.001 to 10 d complexing agent formed during polishing and the addition of water; and the aqueous suspension has a pH of at least 8. |