http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2812079-A1

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filingDate 2000-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4537e07f2ec98216552b0e33c1871e7c
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publicationDate 2002-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber FR-2812079-A1
titleOfInvention CONDUCTO-CONVECTIVE OVEN WITH HELIUM
abstract The invention relates to a means for remelting solder cream or for polymerizing glue on an electronic card (1) with a view to fixing therein components using helium circulating in an enclosure (17), (19), as coupler and thermal carrier due to its high thermal conductivity, and its high calorific capacity compared to all other gases usually used. This process makes it possible to efficiently combine conduction and convection as a means of thermal transfer by neutralizing infrared radiation as much as possible. With identical settings, this process makes it possible to obtain faster temperature rise rates than with other gases as well as very tight extreme thermal profiles less dependent on variations in thermal mass.
priorityDate 2000-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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