| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66068 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088 |
| filingDate |
1997-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae9912b6062ec5252c3536ed6516a630 |
| publicationDate |
1998-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
FR-2765398-A1 |
| titleOfInvention |
STRUCTURE WITH MICROELECTRONIC COMPONENT IN SEMICONDUCTOR MATERIAL DIFFICULT OF ENGRAVING AND WITH METALLIC HOLES |
| abstract |
The invention relates to a structure comprising a microelectronic component (20) made of a semiconductor material which is difficult to etch. This structure is obtained by joining a thin film (12) of the semiconductor material which is difficult to etch on the front face of a first substrate made of material which is easy to etch and which serves as a support. The microelectronic component (20) is produced in the thin film (12) and a through hole (33) is etched in the structure and metallized (35) so as to electrically connect an electrode (18) formed on the rear face of the first substrate to an electrode (24) of the microelectronic component (20). |
| priorityDate |
1997-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |