| abstract |
The invention relates to a method of manufacturing hermetically encapsulated color luminous devices (LEDs) which consists in particular in depositing by masking a first then a second layer of SiO2 on a transparent substrate coated with a conductive layer, one or more color LEDs being formed on a part of the first layer of SiO2, depositing a solder ring on said second layer of SiO2 concentrically, installing a coating glass, comprising on its lower surface a metal ring placed so as to coincide with the solder ring on said substrate and said color LED (s) and heating said solder ring in an inert gas atmosphere. |