| abstract |
The invention relates to the manufacture of semiconductor devices. In a method for mounting on a substrate structures intended for automated tape welding, or TAB structures (1), the terminal conductors of a TAB structure are cut along all four sides by means of a cutting tool. particular. In addition, the chip (2) is glued on the substrate, and / or the remaining parts of the cut terminal conductors are glued on the substrate, after which all the terminals are connected to the connection pads of the substrate, by means of wires connection, in accordance with the prior art. Application to the manufacture of hybrid integrated circuits in small quantities. |