| abstract |
The subject of the invention is a novel polymerizable phenolic compound. The compound according to the invention corresponds to general formula (I) (CF DRAWING IN BOPI) in which X represents a hydrogen or halogen atom, an alkylsulfonyl group, a hydroxyl group or a substituted or unsubstituted phenyl group; Y represents a hydrogen or halogen atom, a hydroxyl group, an alkoxycarbonyl group, an alkyl group, an alkylsulfonyl group, an alkoxy group, an alkanoyloxy group, an acryloyloxy group or a methacryloyloxy group; Z represents -COO-, -O-, -SO2 - or -SO2 NH-; R represents a divalent linking group containing an atom or group -O-, -S-, -SO2 -, -CO- or -NH- or a ring structure; and P represents an acryloyloxy or methacryloyloxy group. Industrial applications: electron acceptor compounds in pressure sensitive reproducing materials and heat sensitive reproducing materials in general and in light sensitive, heat sensitive materials. |